The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Oct. 28, 2008
Applicants:
Seng Guan Chow, Singapore, SG;
Rui Huang, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 25/03 (2013.01); H01L 25/50 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49051 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/078 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A method of manufacturing a semiconductor package system includes: providing a first substrate; providing a second substrate having a cavity, the second substrate being attached to the first substrate; connecting the first substrate to the second substrate using an interconnect, the interconnect being in the cavity; and attaching a semiconductor device to the first substrate or the second substrate.