The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Sep. 26, 2013
Byung Tai DO, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Allan P. Ilagan, Singapore, SG;
Marites Laguipo Roque, Singapore, SG;
Byung Tai Do, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Allan P. Ilagan, Singapore, SG;
Marites Laguipo Roque, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.