Singapore, Singapore

Marites Laguipo Roque

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Marites Laguipo Roque: Innovator in Integrated Circuit Packaging

Introduction

Marites Laguipo Roque is a notable inventor based in Singapore, recognized for her contributions to the field of integrated circuit packaging. With a focus on innovative solutions, she has developed a unique system that enhances the manufacturing process of integrated circuits.

Latest Patents

Marites holds a patent for an "Integrated circuit packaging system with side solderable leads and method of manufacture thereof." This invention features a leadframe with a side solderable lead that includes a half-etched lead portion and a lead top side. The design incorporates a mold body that is directly placed on the leadframe and the side solderable lead, ensuring that the lead top side is exposed from the mold body. Additionally, a mold groove is integrated into the mold body and a portion of the side solderable lead, allowing for the exposure of a lead protrusion on the upper perimeter side of the mold body. The half-etched lead portion is also exposed from the lower perimeter side of the mold body. This innovative approach streamlines the manufacturing process and improves the efficiency of integrated circuit packaging.

Career Highlights

Marites is currently employed at Stats Chippac Pte. Ltd., where she continues to push the boundaries of technology in her field. Her work has significantly impacted the development of integrated circuits, making her a valuable asset to her company and the industry.

Collaborations

Throughout her career, Marites has collaborated with talented individuals such as Byung Tai Do and Emmanuel Espiritu. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Marites Laguipo Roque exemplifies the spirit of innovation in the field of integrated circuit packaging. Her patent and contributions to Stats Chippac Pte. Ltd. highlight her dedication to advancing technology. Her work continues to inspire future generations of inventors and engineers.

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