The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
May. 27, 2016
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Zigmund Ramirez Camacho, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Bartholomew Liao Chung Foh, Singapore, SG;
Dao Nguyen Phu Cuong, Singapore, SG;
Jeffrey David Punzalan, Singapore, SG;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/25 (2013.01); H01L 23/3114 (2013.01); H01L 23/5226 (2013.01); H01L 23/562 (2013.01); H01L 24/17 (2013.01); H01L 2224/1701 (2013.01); H01L 2224/2501 (2013.01); H01L 2224/2505 (2013.01);
Abstract
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
Camacho, Zigmund. (2017). Integrated circuit packaging system with interposer structure and method of manufacture thereof (U.S. Patent No. 9659897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9659897
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile