The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Aug. 11, 2023
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Roel Adeva Robles, Singapore, SG;
Chee Kay Chow, Singapore, SG;
Assignee:
UTAC Headquarters Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); H10P 72/7408 (2026.01); H10P 72/7412 (2026.01); H10P 72/7428 (2026.01);
Abstract
A first carrier has a first plate. A tape is disposed on the first plate. A second plate is disposed over the first plate. The second plate has a trench aligned to the tape and an opening formed through the second plate over the tape. A singulated semiconductor package is disposed on the tape in the opening of the second plate. A second carrier has a static datum and a movable datum. The movable datum is moved toward the static datum. An aperture substrate is disposed around the static datum and movable datum. A manufacturing process is performed on the aperture substrate.