The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Sep. 20, 2021
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Jeffrey Punzalan, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Assignee:
UTAC Headquarters Ptd Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.