The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Dec. 17, 2020
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Il Kwon Shim, Singapore, SG;
Jeffrey Punzalan, Singapore, SG;
Assignee:
UTAC Headquarters Pte. Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 23/31 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 2021/60097 (2013.01);
Abstract
A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.