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For the Inventor, By the Inventor

Espoo, Finland

Imbera Electronics Oy

Calculating rank
USPTO Granted Patents = 26

% Expired Patents = 3.8



Forward Citations = 329

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6 inventors (with patents filed for the assignee):

goldMedal Risto Tuominen (22 out of 43 patents)

silverMedal Petteri Palm (15 out of 84 patents)

bronzeMedal Antti Iihola (11 out of 35 patents)

4.  Timo Jokela (2 out of 5 patents)

5.  Tuomas Waris (1 out of 6 patents)

6.  Arni Kujala (1 out of 2 patents)

7.  Jorma Kivilahti (2 patents)

8.  Petteri Palm (0 patent)

9.  Petteri Palm (0 patent)

10.  Petteri Palm (0 patent)


Core Competencies:
Circuit Board Structure
Embedded Component
Electronics Module
Manufacturing Method
Wiring Patterns
Conductive Pattern Layer
Microcircuit
Heat Conduction
Feed Through Conductor
Vertical Connector
Installation Base

26 patents:

1. 8631566 - Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component (2014-01-21),
2. 8581109 - Method for manufacturing a circuit board structure (2013-11-12),
3. 8547701 - Electronics module and method for manufacturing the same (2013-10-01),
4. 8487194 - Circuit board including an embedded component (2013-07-16),
5. 8455994 - Electronic module with feed through conductor between wiring patterns (2013-06-04),
6. 8368201 - Method for embedding a component in a base (2013-02-05),
7. 8351214 - Electronics module comprising an embedded microcircuit (2013-01-08),
8. 8286341 - Method of manufacturing a wiring board (2012-10-16),
9. 8240033 - Method for manufacturing a circuit board (2012-08-14),
10. 8240032 - Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer (2012-08-14),
11. 8238113 - Electronic module with vertical connector between conductor patterns (2012-08-07),
12. 8225499 - Method for manufacturing a circuit board structure, and a circuit board structure (2012-07-24),
13. 8222723 - Electric module having a conductive pattern layer (2012-07-17),
14. 8076586 - Heat conduction from an embedded component (2011-12-13),
15. 8062537 - Method for manufacturing an electronics module (2011-11-22),
Company Overview
Imbera Electronics Oy, based in Espoo, Finland, specializes in the development and manufacturing of advanced electronic solutions. The company focuses on innovative technologies in the fields of embedded systems, telecommunications, and industrial automation. With a commitment to quality and precision, Imbera serves various sectors, providing tailored solutions that enhance operational efficiency and connectivity. Their expertise in electronics positions them as a key player in the evolving landscape of technology-driven industries.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

26 Patents

#29 in Espoo

#137 in Finland

#24,830 in the World

Espoo, FI
Espoo, Finland

Imbera Electronics Oy

Forward Citations = 329

6 inventors:

goldMedal Risto Tuominen (22 out of 43 patents)

silverMedal Petteri Palm (15 out of 84 patents)

bronzeMedal Antti Iihola (11 out of 35 patents)

4.  Timo Jokela (2 out of 5 patents)

5.  Tuomas Waris (1 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Imbera Electronics Oy. Retrieved from https://idiyas.com/company/imbera-electronics-oy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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