The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Jun. 13, 2005
Antti Iihola, Helsinki, FI;
Timo Jokela, Halikko, FI;
Petteri Palm, Helsinki, FI;
Risto Tuominen, Helsinki, FI;
Antti Iihola, Helsinki, FI;
Timo Jokela, Halikko, FI;
Petteri Palm, Helsinki, FI;
Risto Tuominen, Helsinki, FI;
Imbera Electronics Oy, Esppo, FI;
Abstract
Method for manufacturing an electronic module, which electronic module includes a component (), which is connected electrically to a conductor-pattern layer (). In the method contact openings () are made in the conductor layer (), the mutual positions of which correspond to the mutual positions of the contact areas () of the component (). After this, the component () and the conductor layer () are aligned relative to each other, in such a way that the contact areas () of the component () come to the positions of the contact openings (), and the component () is secured. After this, at least in the contact openings () and the contact areas () of the component () a conductor material is made that connects the component () to the conductor layer (). After the making of the contact the conductor layer () is patterned to form a conductor-pattern layer ().