Electronic module with feed through conductor between wiring patterns

Abstract

The electronic module comprises a dielectricsubstrate having a first surface and a second surface and an installation cavity extending through the dielectric substrate and having a perimetrical side wall. The electronic module further comprises a first wiring layeron the first surface, a second wiring layeron the second surface, and a feed through conductoron the perimetrical side wall and electrically connecting at least one conductor in the first wiring layer to at least one conductor in the second wiring layer. There is also at least one IC inside the installation cavity. The electronic module further comprises a first insulating layeron the second wiring layer, a second insulating layeron the first wiring layer, and a third wiring layeron the first insulating layer. First microviasinside the first insulating layer make electrical connections between the second wiring layer and the third wiring layer. Second microviaselectrically connect the IC to at least one of the second wiring layer and the third wiring layer. The electronic module comprises also a fourth wiring layeron the second insulating layer and third microviasinside the second insulating layer and making electrical connections between the first wiring layer and the fourth wiring layer.