The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Nov. 23, 2005
Risto Tuominen, Helsinki, FI;
Antti Iihola, Helsinki, FI;
Risto Tuominen, Helsinki, FI;
Antti Iihola, Helsinki, FI;
Imbera Electronics Oy, Espoo, FI;
Abstract
Method for manufacturing an electronic module, which electronic module includes a component (), which has contact areas (), which are connected electrically to a conductor-pattern layer (). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer () and an insulator layer () on the first surface of the conductor layer (). Contact openings (), the mutual positions of which correspond to the mutual positions of the contact areas () of the component (), and which penetrate both the conductor layer () and the insulator layer (), are made in the membrane. After the manufacture of the contact openings (), the component () is attached to the surface of the insulator layer (), in such a way that the contact areas () of the component () line up next to the contact openings (). After this, at least in the contact openings () and the contact areas () of the component () a conductor material is made, which connects the component () to the conductor layer () and the conductor layer () is patterned to form a conductor-pattern layer ().