The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Jun. 16, 2006
Applicants:
Risto Tuominen, Helsinki, FI;
Antti Iihola, Helsinki, FI;
Petteri Palm, Helsinkin, FI;
Inventors:
Assignee:
Imbera Electronics Oy, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
This publication discloses a method for manufacturing a circuit-board structure.. The structure comprises a conductor pattern () and at least one component (), which is surrounded by an insulating-material layer (), attached to it by means of a contact bump (). According to the invention, the contact bumps () are made on the surface of the conductor pattern (), before the component () is attached to the conductor pattern () by means of the contact bump (). After attaching, the component () is surrounded with an insulating-material layer ().