The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Sep. 27, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Sergey Yuferev, Villach, AT;
Paul Armand Asentista Calo, Villach, AT;
Theng Chao Long, Melaka, MY;
Josef Maerz, Oberhaching, DE;
Chee Yang Ng, Muar, MY;
Petteri Palm, Stein, DE;
Wae Chet Yong, Malacca, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 25/50 (2013.01);
Abstract
A package and method of manufacturing a package is disclosed. In one example, a package which comprises a first transistor chip having a first source pad and a second transistor chip having a second source pad and being stacked with the first transistor chip at an interface area. The first source pad and the second source pad are coupled at the interface area.