Sergey Yuferev

Title: Innovations of Sergey Yuferev

Introduction

Sergey Yuferev is a notable inventor based in Villach, Austria. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on innovative packaging solutions that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor package with non-uniformly distributed vias. This invention features a semiconductor device embedded in an insulating layer, with a first contact pad at the device's surface. The design includes an outer contact pad on the lower surface of the insulating layer, connected by a vertical redistribution structure. Notably, the first contact pad has multiple via sites, with a portion occupied by first vias and others forming a via-free zone, allowing for a non-uniform distribution of vias. Another significant patent is for a stacked transistor chip package with source coupling. This package comprises two transistor chips stacked together, with their source pads coupled at the interface area, enhancing the overall functionality of the device.

Career Highlights

Sergey has worked with prominent companies in the semiconductor industry, including Infineon Technologies Austria AG and Infineon Technologies AG. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Sergey has collaborated with talented professionals such as Robert Fehler and Petteri Palm. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Sergey Yuferev's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative solutions continue to shape the future of semiconductor packaging.