The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Sep. 04, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); G06F 30/398 (2020.01); G06F 30/394 (2020.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); G06F 30/394 (2020.01); G06F 30/398 (2020.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/5283 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 2224/06182 (2013.01);
Abstract
In an embodiment, a semiconductor package includes a semiconductor device embedded in an insulating layer, a contact pad having an area, and a vertical redistribution structure including substantially parallel vertical paths arranged in the insulating layer and extending perpendicular to the area of the contact pad. The substantially vertical paths are non-uniformly distributed over the area of the contact pad.