Infineon Technologies Austria Ag

Infineon Technologies Ag

Sergey Yuferev

Petteri Palm

Robert Fehler

Gerhard Noebauer

Josef Hoeglauer

Angela Kessler

Hao Zhuang

Chee Yang Ng

Wae Chet Yong

Theng Chao Long

Josef Maerz

Paul Armand Asentista Calo

A method for manufacturing a semiconductor package includes: providing a leadframe having component positions each of which includes a die pad; providing semiconductor dies each having a first power electrode on a first main surface and a second power electrode on a second main surface; mounting a respective semiconductor die onto the die pad of a respective component position of the leadframe such that the first power electrode is attached to the die pad; mounting a clip onto the dies such that the clip is attached to a respective second power electrode; embedding at least the side faces of the dies and inner surfaces of the leadframe and clip in a mold compound to form a subassembly; and cutting through the clip and leadframe at positions between neighbouring component positions.

Methods for manufacturing a semiconductor package and a semiconductor module

In an embodiment, a semiconductor package includes a semiconductor device embedded in an insulating layer and having a first contact pad at a first surface of the semiconductor device. An outer contact pad is positioned on a lower surface of the insulating layer. A vertical redistribution structure electrically couples the first contact pad to the outer contact pad. The first contact pad has a plurality of first via sites. A first subset of the first via sites is occupied by first vias and a second subset of the first via sites remains unoccupied and forms a first via-free zone, such that the first vias are non-uniformly distributed over the first contact pad.

Semiconductor package with non-uniformly distributed vias

A package and method of manufacturing a package is disclosed. In one example, a package which comprises a first transistor chip having a first source pad and a second transistor chip having a second source pad and being stacked with the first transistor chip at an interface area. The first source pad and the second source pad are coupled at the interface area.

Stacked transistor chip package with source coupling

A semiconductor module is provided that includes a low side switch, a high side switch and a control chip. The low side switch and the high side switch are arranged laterally adjacent one another and coupled by a switch node connector to form a half bridge circuit. The switch node connector includes two or more branches that have an arrangement with respect to the low side switch and to the high side switch and that each have a cross-sectional area.

Semiconductor module having a multi-branch switch node connector

A semiconductor package includes a semiconductor die having opposing first and second main surfaces, a first power electrode on the first main surface and a second power electrode on the second main surface, a first lead having an inner surface attached to the first power electrode and a distal end having a first protruding side face extending substantially perpendicularly to the first main surface of the die, a second lead having an inner surface attached to the second power electrode and a distal end having a second protruding side face extending substantially perpendicularly to the second main surface of the die, and a mold compound enclosing at least part of the die and at least part of the first and second leads. The first lead includes a recess positioned in an edge of the inner surface. The second lead includes a recess positioned in an edge of the inner surface.

Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module

In an embodiment, a semiconductor module includes a low side switch and a high side switch. The low side switch and the high side switch are arranged laterally adjacent one another and coupled in series between a ground package pad and a voltage input (VIN) package pad of the semiconductor module and form a half bridge configuration having an output node. The semiconductor module further includes a first capacitor pad coupled to ground potential and a second capacitor pad coupled to a VIN potential. The first capacitor pad is arranged vertically above the low side switch and the second capacitor pad is arranged vertically above the high side switch.

Semiconductor module

A circuitry is provided. The circuitry may include a power stage including a first transistor and a second transistor, an encapsulation including encapsulation material encapsulating the power stage, wherein the first transistor and the second transistor are arranged in an L-shape with respect to each other along their long axes, and a passive electronic component arranged on or embedded within the encapsulation at least partially, in top view, within a rectangular area defined by the L-shape configuration and further next to the first transistor and next to the second transistor.

Circuitry and method of forming a circuitry

A semiconductor module is provided that includes a low side switch, a high side switch and a control chip. The low side switch and the high side switch are arranged laterally adjacent one another and coupled by a switch node connector to form a half bridge circuit. The switch node connector includes two or more branches that have an arrangement with respect to the low side switch and to the high side switch and that each have a cross-sectional area. The arrangement and the cross-sectional area of the two or more branches are selected so as to homogenise the current density distribution within the switch node connector.

In an embodiment, a semiconductor package includes a semiconductor device embedded in an insulating layer, a contact pad having an area, and a vertical redistribution structure including substantially parallel vertical paths arranged in the insulating layer and extending perpendicular to the area of the contact pad. The substantially vertical paths are non-uniformly distributed over the area of the contact pad.

Semiconductor package and method of manufacturing a semiconductor package

A semiconductor package includes a semiconductor die having a semiconductor device, and first and second contact pads arranged on opposite surfaces of the die. The semiconductor die is embedded in a dielectric layer. The semiconductor package also includes one or more first package contact pads and one or more second package contact pads arranged on a first major surface of the semiconductor package. The first contact pad of the die is coupled to the one or more first package contact pads, and the second contact pad of the die is coupled to the one or more second package contact pads. In operation, the semiconductor device causes a current path between the first contact pad and the second contact pad. The package contact pads are arranged on the first major surface of the semiconductor package to provide multiple non-parallel current paths.

Growing community of inventors

Villach, Austria

Sergey Yuferev