IDiyas

For the Inventor, By the Inventor

Johor, Malaysia

Chee Yang Ng

USPTO Granted Patents = 22 

 

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Muar Johor, MY (2022)
  • Johor, MY (2015 - 2023)
  • Muar, MY (2018 - 2024)

Company Filing History:

goldMedal19 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal3 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2015-2025

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 12412797 - Hybrid embedded package (2025-09-09),
2. 12232302 - Dipped coated electronic module assembly with enhanced thermal distribution (2025-02-18),
3. 12150236 - Voltage regulator module with inductor-cooled power stage (2024-11-19),
4. 12136583 - Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement (2024-11-05),
5. 12094807 - Stacked transistor chip package with source coupling (2024-09-17),
6. 11984392 - Semiconductor package having a chip carrier with a pad offset feature (2024-05-14),
7. 11676879 - Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier (2023-06-13),
8. 11521907 - Hybrid embedded package (2022-12-06),
9. 11393743 - Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation (2022-07-19),
10. 11289436 - Semiconductor package having a laser-activatable mold compound (2022-03-29),
11. 11174152 - Over-under sensor packaging with sensor spaced apart from control chip (2021-11-16),
12. 11039231 - Package with acoustic sensing device(s) and millimeter wave sensing elements (2021-06-15),
13. 10770399 - Semiconductor package having a filled conductive cavity (2020-09-08),
14. 10549985 - Semiconductor package with a through port for sensor applications (2020-02-04),
15. 10501312 - Over-under sensor packaging with sensor spaced apart from control chip (2019-12-10),

Title: Chee Yang Ng: Pioneering Inventor from Johor

Introduction: Chee Yang Ng is a highly accomplished inventor hailing from Johor, Malaysia. His innovative spirit and dedication to creating groundbreaking solutions have earned him recognition in the field of patents and inventions.

Latest Patents: Chee Yang Ng's most recent patents focus on sustainable energy solutions and advanced materials. His inventions aim to address pressing global challenges while incorporating cutting-edge technology.

Career Highlights: With a career spanning over two decades, Chee Yang Ng has established himself as a leading figure in the world of innovation. He has a proven track record of transforming creative ideas into tangible products that have a positive impact on society.

Collaborations: Throughout his career, Chee Yang Ng has collaborated with various research institutions, universities, and companies to further develop his inventions. These partnerships have been instrumental in bringing his ideas to fruition and commercialization.

Conclusion: Chee Yang Ng's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the field of inventions. His contributions continue to inspire the next generation of inventors and shape the future of technology.

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