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For the Inventor, By the Inventor

Johor, Malaysia

Chee Yang Ng

This inventor holds 23 USPTO granted patents and 13 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chee Yang Ng. Retrieved from https://idiyas.com/inventor/chee-yang-ng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

 

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Muar Johor, MY (2022)
  • Johor, MY (2015 - 2023)
  • Muar, MY (2018 - 2024)

Company Filing History:

goldMedal20 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal3 out of 2,201 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2015-2026

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Areas of Expertise:
Intermetallic Connection
Hybrid Embedded Package
Thermal Distribution
Voltage Regulator Module
Transistor Chip Package
Conductive Frame
Acoustic Sensing Device
Conductive Cavity
Embedded Conductive Layer
Integrated Passives Package
Chip Carrier
Laser-Activatable Mold
23 patents (USPTO):Explore Patents
1. 12616039 - Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures (2026-04-28),
2. 12412797 - Hybrid embedded package (2025-09-09),
3. 12232302 - Dipped coated electronic module assembly with enhanced thermal distribution (2025-02-18),
4. 12150236 - Voltage regulator module with inductor-cooled power stage (2024-11-19),
5. 12136583 - Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement (2024-11-05),
6. 12094807 - Stacked transistor chip package with source coupling (2024-09-17),
7. 11984392 - Semiconductor package having a chip carrier with a pad offset feature (2024-05-14),
8. 11676879 - Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier (2023-06-13),
9. 11521907 - Hybrid embedded package (2022-12-06),
10. 11393743 - Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation (2022-07-19),
11. 11289436 - Semiconductor package having a laser-activatable mold compound (2022-03-29),
12. 11174152 - Over-under sensor packaging with sensor spaced apart from control chip (2021-11-16),
13. 11039231 - Package with acoustic sensing device(s) and millimeter wave sensing elements (2021-06-15),
14. 10770399 - Semiconductor package having a filled conductive cavity (2020-09-08),
15. 10549985 - Semiconductor package with a through port for sensor applications (2020-02-04),

Title: Chee Yang Ng: Pioneering Inventor from Johor

Introduction: Chee Yang Ng is a highly accomplished inventor hailing from Johor, Malaysia. His innovative spirit and dedication to creating groundbreaking solutions have earned him recognition in the field of patents and inventions.

Latest Patents: Chee Yang Ng's most recent patents focus on sustainable energy solutions and advanced materials. His inventions aim to address pressing global challenges while incorporating cutting-edge technology.

Career Highlights: With a career spanning over two decades, Chee Yang Ng has established himself as a leading figure in the world of innovation. He has a proven track record of transforming creative ideas into tangible products that have a positive impact on society.

Collaborations: Throughout his career, Chee Yang Ng has collaborated with various research institutions, universities, and companies to further develop his inventions. These partnerships have been instrumental in bringing his ideas to fruition and commercialization.

Conclusion: Chee Yang Ng's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the field of inventions. His contributions continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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