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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11676879 B1

PDFFull Text
Date of Patent:
Jun. 13, 2023

Filed:

Sep. 28, 2020

Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Stefan Woetzel, Erfurt, DE;

Chee Yang Ng, Johor, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/296 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32175 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15763 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A semiconductor package includes: a carrier having a first side and a second side opposite the first side, the first side having a plurality of contact structures; a semiconductor die having a first side and a second side opposite the first side, the first side of the semiconductor die having a plurality of pads attached to the plurality of contact structures at the first side of the carrier; a metal plate attached to the second side of the semiconductor die, the metal plate having a size that is independent of the size of the carrier and based on an expected thermal load to be presented by the semiconductor die; and an encapsulant confined by the carrier and the metal plate and laterally surrounding an edge of the semiconductor die. Corresponding methods of production are also provided.

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