The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Nov. 13, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Kok Yau Chua, Melaka, MY;

Chee Yang Ng, Johor, MY;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); G01S 13/86 (2006.01); G10L 15/22 (2006.01); H04R 3/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/025 (2013.01); G01S 13/86 (2013.01); G10L 15/22 (2013.01); H04R 3/00 (2013.01); H04R 31/006 (2013.01);
Abstract

In accordance with an embodiment a package includes: a package structure which defines inner surfaces delimiting an inner volume and outer surfaces directed towards an exterior of the package; at least one acoustic sensor element applied to at least one of the inner surfaces, to convert acoustic waves arriving from the exterior of the package into acoustic information in the form of electric signals; a plurality of millimeter wave sensing elements applied to at least one of the outer surfaces, to receive reflected radar signals from objects in the exterior of the package; and a circuitry applied to at least one of the inner surfaces of the package structure, wherein the circuitry is electrically connected to the at least one acoustic sensor element and the plurality of millimeter wave sensing elements to process the acoustic information and the reflected radar signals.


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