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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12616039 B1

PDFFull Text
Date of Patent:
Apr. 28, 2026

Filed:

Jul. 25, 2022

Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Chee Yang Ng, Muar, MY;

Edmund Riedl, Wald, DE;

Joseph Victor Soosai Prakasam, Malacca, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/49568 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract

An electronic system is disclosed. In one example, the electronic system comprises an at least partially electrically conductive carrier, an electronic component, and an intermetallic connection structure connecting the carrier and the component. The intermetallic connection structure comprising an intermetallic mesh structure in a central portion of the intermetallic connection structure, and opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier or the component.

Find Patent Forward Citations

Ng, Chee. (2026). Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures (U.S. Patent No. 12616039). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12616039

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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