The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Aug. 31, 2017
Infineon Technologies Ag, Neubiberg, DE;
Dominic Maier, Pleystein, DE;
Matthias Steiert, Rosenheim, DE;
Chau Fatt Chiang, Melaka, MY;
Christian Geissler, Teugn, DE;
Bernd Goller, Otterfing, DE;
Thomas Kilger, Regenstauf, DE;
Johannes Lodermeyer, Kinding, DE;
Franz-Xaver Muehlbauer, Rimbach, DE;
Chee Yang Ng, Johor, MY;
Beng Keh See, Melaka, MY;
Claus Waechter, Sinzing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.