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For the Inventor, By the Inventor

Otterfing, Germany

Bernd Goller

This inventor holds 32 USPTO granted patents and 3 published patent applications and 6 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Siemens Aktiengesellschaft. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernd Goller. Retrieved from https://idiyas.com/inventor/bernd-goller

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 65.6

 

Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 342(Granted Patents)


Location History:

  • Kemnath, DE (2004 - 2005)
  • Otterfing, DE (2005 - 2024)

Company Filing History:

goldMedal31 out of 15,023 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 30,867 
 
Siemens Aktiengesellschaft
 patents

Years Active: 2004-2026

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Areas of Expertise:
Pressure Transducer
Silicon MEMS
Radio Frequency Losses
Semiconductor Module
MEMS Assembly
Vertical Interconnect
Sensor Applications
Heat Capacity
Smart Card Module
Biosensor
Multichip Module
Plastic Embedding
32 patents (USPTO):Explore Patents
1. 12630417 - Pressure transducer package having a rigid transfer block for assembly tolerance (2026-05-19),
2. 12063474 - Methods of environmental protection for silicon MEMS structures in cavity packages (2024-08-13),
3. 11574879 - Device package with reduced radio frequency losses (2023-02-07),
4. 11117798 - MEMS-sensor (2021-09-14),
5. 11040872 - Semiconductor module (2021-06-22),
6. 10793419 - MEMS assembly (2020-10-06),
7. 10707158 - Package with vertical interconnect between carrier and clip (2020-07-07),
8. 10570007 - MEMS assembly and method for producing a MEMS assembly (2020-02-25),
9. 10549985 - Semiconductor package with a through port for sensor applications (2020-02-04),
10. 10435292 - Method for producing a semiconductor module (2019-10-08),
11. 10377626 - Apparatus with a high heat capacity and method for producing the same (2019-08-13),
12. 10161908 - Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid (2018-12-25),
13. 8753901 - Semiconductor wafer with electrically connected contact and test areas (2014-06-17),
14. 8466009 - Method of fabricating a semiconductor package with mold lock opening (2013-06-18),
15. 8044394 - Semiconductor wafer with electrically connected contact and test areas (2011-10-25),

Title: Bernd Goller - Innovator from Otterfing, DE

Introduction:

Bernd Goller is a renowned inventor hailing from Otterfing, Germany, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Bernd Goller holds several patents in the areas of renewable energy, sustainable transportation, and advanced manufacturing processes. His recent patents focus on enhancing efficiency and reducing environmental impact.

Career Highlights:

Throughout his illustrious career, Bernd Goller has worked with leading research institutions and technology companies to develop cutting-edge solutions. His innovative approach has led to significant advancements in various industries.

Collaborations:

Bernd Goller has collaborated with top engineers, scientists, and designers to bring his ideas to life. His ability to work in multidisciplinary teams has resulted in successful projects that have revolutionized the way we approach complex challenges.

Conclusion:

In conclusion, Bernd Goller's passion for innovation and his relentless pursuit of excellence have established him as a key figure in the world of technology. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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