Bernd Goller

This inventor holds 32 USPTO granted patents and 3 published patent applications and 6 EPO patents. Top assignees: Infineon Technologies Ag, Siemens Aktiengesellschaft. Active years: 2004-2026.

USPTO Granted Patents = 32 (Patent Applications = 3)

% Patents Active = 65.6

EPO Patents = 6 (Patent Applications = 4)

Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 342(Granted Patents)

Location History:

Kemnath, DE (2004 - 2005)
Otterfing, DE (2005 - 2024)

Company Filing History:

31 out of 15,005

Infineon Technologies Ag

patents

1 out of 30,852

Siemens Aktiengesellschaft

patents

Years Active: 2004-2026

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Areas of Expertise:

Silicon MEMS Structures

Environmental Protection

Radio Frequency Losses

MEMS Sensors

Semiconductor Modules

Vertical Interconnects

Hydrodynamic Pressure Measurement

Smart Card Technology

Biosensors

Electronic Components

Multichip Modules

Universal Semiconductor Packaging

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12630417 - Pressure transducer package having a rigid transfer block for assembly tolerance (2026-05-19),

2. 12063474 - Methods of environmental protection for silicon MEMS structures in cavity packages (2024-08-13),

3. 11574879 - Device package with reduced radio frequency losses (2023-02-07),

4. 11117798 - MEMS-sensor (2021-09-14),

5. 11040872 - Semiconductor module (2021-06-22),

6. 10793419 - MEMS assembly (2020-10-06),

7. 10707158 - Package with vertical interconnect between carrier and clip (2020-07-07),

8. 10570007 - MEMS assembly and method for producing a MEMS assembly (2020-02-25),

9. 10549985 - Semiconductor package with a through port for sensor applications (2020-02-04),

10. 10435292 - Method for producing a semiconductor module (2019-10-08),

11. 10377626 - Apparatus with a high heat capacity and method for producing the same (2019-08-13),

12. 10161908 - Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid (2018-12-25),

13. 8753901 - Semiconductor wafer with electrically connected contact and test areas (2014-06-17),

14. 8466009 - Method of fabricating a semiconductor package with mold lock opening (2013-06-18),

15. 8044394 - Semiconductor wafer with electrically connected contact and test areas (2011-10-25),

Title: Bernd Goller - Innovator from Otterfing, DE

Introduction:

Bernd Goller is a renowned inventor hailing from Otterfing, Germany, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Bernd Goller holds several patents in the areas of renewable energy, sustainable transportation, and advanced manufacturing processes. His recent patents focus on enhancing efficiency and reducing environmental impact.

Career Highlights:

Throughout his illustrious career, Bernd Goller has worked with leading research institutions and technology companies to develop cutting-edge solutions. His innovative approach has led to significant advancements in various industries.

Collaborations:

Bernd Goller has collaborated with top engineers, scientists, and designers to bring his ideas to life. His ability to work in multidisciplinary teams has resulted in successful projects that have revolutionized the way we approach complex challenges.

Conclusion:

In conclusion, Bernd Goller's passion for innovation and his relentless pursuit of excellence have established him as a key figure in the world of technology. His contributions continue to inspire future generations of inventors and innovators.