The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
May. 13, 2010
Bernd Goller, Otterfing, DE;
Markus Dinkel, Taufkirchen, DE;
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Boon Kian Lim, Melacca, MY;
Bernd Goller, Otterfing, DE;
Markus Dinkel, Taufkirchen, DE;
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Boon Kian Lim, Melacca, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.