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For the Inventor, By the Inventor

Malacca, Malaysia

Wae Chet Yong

USPTO Granted Patents = 14 

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Melaka, MY (2010 - 2012)
  • Semabok, MY (2012)
  • Malacca, MY (2010 - 2023)

Company Filing History:

goldMedal14 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2010-2024

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 12094807 - Stacked transistor chip package with source coupling (2024-09-17),
2. 11569196 - Chip to chip interconnect in encapsulant of molded semiconductor package (2023-01-31),
3. 11133281 - Chip to chip interconnect in encapsulant of molded semiconductor package (2021-09-28),
4. 10978378 - Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier (2021-04-13),
5. 8466009 - Method of fabricating a semiconductor package with mold lock opening (2013-06-18),
6. 8377753 - Method of fabricating a semiconductor device having a resin with warpage compensated structures (2013-02-19),
7. 8207601 - Electronic component and a method of fabricating an electronic component (2012-06-26),
8. 8169069 - Integrated semiconductor outline package (2012-05-01),
9. 8110906 - Semiconductor device including isolation layer (2012-02-07),
10. 8067841 - Semiconductor devices having a resin with warpage compensated surfaces (2011-11-29),
11. 7821141 - Semiconductor device (2010-10-26),
12. 7791182 - Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing (2010-09-07),
13. 7732937 - Semiconductor package with mold lock vent (2010-06-08),
14. 7723165 - Method of forming component package (2010-05-25),

Wae Chet Yong: A Pioneer in Semiconductor Innovations

Introduction

Wae Chet Yong is a distinguished inventor based in Malacca, Malaysia, renowned for his contributions to the field of semiconductor technology. With a remarkable portfolio of 14 patents, Yong continues to push the boundaries of innovation in the industry.

Latest Patents

Among his latest inventions are two notable patents that showcase his ingenuity:

1. **Stacked transistor chip package with source coupling** - This patent reveals a novel package and method for manufacturing it. It features a stacked arrangement of a first transistor chip with a first source pad and a second transistor chip with a second source pad, which are coupled at an interface area.

2. **Chip to chip interconnect in encapsulant of molded semiconductor package** - This innovation involves a packaged semiconductor that includes an electrically insulating encapsulant body. It contains two semiconductor dies positioned side by side, each equipped with conductive pads, and a conductive track connects them within the encapsulant body, which is made from a laser activatable mold compound.

Career Highlights

Wae Chet Yong currently works at Infineon Technologies AG, a leader in the semiconductor industry. His significant achievements in developing semiconductor packaging technologies underscore his expertise and commitment to advancement in electronics.

Collaborations

Throughout his career, Yong has collaborated with talented colleagues, including Stanley Job Doraisamy and Teck Sim Lee. Their teamwork and shared expertise foster a creative environment that drives innovation at Infineon Technologies AG.

Conclusion

Wae Chet Yong exemplifies the spirit of innovation in technology through his impressive patent portfolio and collaborative efforts within the semiconductor field. His contributions not only push technological boundaries but also inspire future generations of inventors and engineers.

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