The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Nov. 10, 2011
Chai Wei Heng, Melaka, MY;
Wae Chet Yong, Malacca, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Khai Huat Jeffrey Low, Melaka, MY;
Gerhard Deml, Munich, DE;
Chai Wei Heng, Melaka, MY;
Wae Chet Yong, Malacca, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Khai Huat Jeffrey Low, Melaka, MY;
Gerhard Deml, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.