The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Mar. 15, 2008
Applicants:
Soon Hock Tong, Melaka, MY;
Wae Chet Yong, Melaka, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isolation layer on the rear of the die pad or heat sink.