The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Mar. 04, 2008
Bernd Goller, Otterfing, DE;
Markus Dinkel, Taufkirchen, DE;
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Boon Kian Lim, Melacca, MY;
Bernd Goller, Otterfing, DE;
Markus Dinkel, Taufkirchen, DE;
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Boon Kian Lim, Melacca, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.