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For the Inventor, By the Inventor

Unterhaching, Germany

Markus Dinkel

This inventor holds 27 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Tinfineon Technologies Austria Ag. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Markus Dinkel. Retrieved from https://idiyas.com/inventor/markus-dinkel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 27 

% Patents Active = 74.1

 

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 48(Granted Patents)


Location History:

  • Taufkirchen, DE (2010 - 2013)
  • Unterhaching, DE (2015 - 2024)

Company Filing History:

goldMedal22 out of 15,040 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,211 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 1 
 
Tinfineon Technologies Austria Ag
 patent

Years Active: 2010-2026

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Areas of Expertise:
Semiconductor Chip
Chip System
SMD Package
Transistor Packages
Cooling Techniques
Leadframe
Power Package
Electronic Module
Interconnect Module
Carrier
Manufacturing Method
Magnetic Field Sensor
27 patents (USPTO):Explore Patents
1. 12765398 - Semiconductor package with hybrid interconnect clip (2026-10-13),
2. 12628662 - Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip system (2026-05-12),
3. 12308339 - Method of manufacturing a package using a clip having at least one locking recess (2025-05-20),
4. 11915999 - Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element (2024-02-27),
5. 11776882 - Method of fabricating a semiconductor package (2023-10-03),
6. 11728309 - Clip having locking recess for connecting an electronic component with a carrier in a package (2023-08-15),
7. 11600558 - Plurality of transistor packages with exposed source and drain contacts mounted on a carrier (2023-03-07),
8. 11342252 - Leadframe leads having fully plated end faces (2022-05-24),
9. 11302610 - Semiconductor package and method of fabricating a semiconductor package (2022-04-12),
10. 10903133 - Method of producing an SMD package with top side cooling (2021-01-26),
11. 10813229 - Electronic module having an electrically insulating structure with material having a low modulus of elasticity (2020-10-20),
12. 10796986 - Leadframe leads having fully plated end faces (2020-10-06),
13. 10699987 - SMD package with flat contacts to prevent bottleneck (2020-06-30),
14. 10566260 - SMD package with top side cooling (2020-02-18),
15. 10168391 - Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto (2019-01-01),

Title: Markus Dinkel - Innovative Inventor from Unterhaching

Introduction: Markus Dinkel is a renowned inventor hailing from Unterhaching, Germany, known for his groundbreaking contributions to various fields of technology and innovation.

Latest Patents: Markus Dinkel holds several patents in the areas of renewable energy, sustainable materials, and advanced robotics, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Markus Dinkel has worked with leading research institutions and tech companies to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Markus Dinkel has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life, resulting in successful products and technologies that have received international acclaim.

Conclusion: Markus Dinkel's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs, making him a true pioneer in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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