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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11915999 B1

PDFFull Text
Date of Patent:
Feb. 27, 2024

Filed:

Jan. 31, 2023

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Tomasz Naeve, Finkenstein, AT;

Ralf Otremba, Kaufbeuren, DE;

Thorsten Scharf, Lappersdorf, DE;

Markus Dinkel, Unterhaching, DE;

Martin Gruber, Schwandorf, DE;

Elvir Kahrimanovic, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2023.01); H01L 25/075 (2006.01); H01L 25/04 (2023.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/4012 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/043 (2013.01); H01L 25/0655 (2013.01); H01L 25/0756 (2013.01); H01L 2924/181 (2013.01); H02P 27/06 (2013.01); H02P 2201/03 (2013.01);
Abstract

A semiconductor device includes: a carrier including an electronic circuit; a plurality of semiconductor chip packages mounted on the carrier, each of the chip packages including an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.

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Naeve, Tomasz. (2024). Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element (U.S. Patent No. 11915999). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11915999

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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