The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Sep. 07, 2018
Infineon Technologies Austria Ag, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Markus Dinkel, Unterhaching, DE;
Ulrich Froehler, Nersingen, DE;
Josef Hoeglauer, Heimstetten, DE;
Uwe Kirchner, St. Michael i. Lav., AT;
Guenther Lohmann, Sattendorf, AT;
Klaus Schiess, Allensbach, DE;
Xaver Schloegel, Sachsenkam, DE;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A package encloses a power semiconductor die and has a package body with a package top side, package footprint side and package sidewalls. The die has first and second load terminals and blocks a blocking voltage between the load terminals. The package further includes: a lead frame structure for electrically and mechanically coupling the package to a support, the lead frame structure including an outside terminal extending out of the package footprint side and/or out of one of the package sidewalls and electrically connected with the first load terminal; a top layer arranged at the package top side and electrically connected with the second load terminal; and a heat spreader arranged external of the package body and in electrical contact with the top layer. A top surface of the heat spreader has an area greater than the area of the bottom surface.