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For the Inventor, By the Inventor

Allensbach, Germany

Klaus Schiess

This inventor holds 76 USPTO granted patents and 9 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Infineon Technologies Austria Ag, Infineon Technologies Ag, Tinfineon Technologies Austria Ag. Active years: 2009-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Klaus Schiess. Retrieved from https://idiyas.com/inventor/klaus-schiess

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 76 

% Patents Active = 85.5

 

Average Co-Inventor Count = 3.7

ph-index = 8

Forward Citations = 233(Granted Patents)

Forward Citations (Not Self Cited) = 219(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal38 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
silverMedal37 out of 15,027 
 
Infineon Technologies Ag
 patents
bronzeMedal1 out of 1 
 
Tinfineon Technologies Austria Ag
 patent

Years Active: 2009-2025

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Areas of Expertise:
Semiconductor Package
Top Side Cooling
Bidirectional Switch
SMD Package
Compound Semiconductor
Electronic Component
Thermal Pathway
Driver Circuit
Multilevel Carrier
Current Flow
Chip Carrier Structure
76 patents (USPTO):Explore Patents
1. 12412815 - Semiconductor package and method of manufacturing a semiconductor package (2025-09-09),
2. 11923276 - Semiconductor device including a bidirectional switch (2024-03-05),
3. 11676881 - Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package (2023-06-13),
4. 11605577 - Semiconductor device including a bidirectional switch (2023-03-14),
5. 11289436 - Semiconductor package having a laser-activatable mold compound (2022-03-29),
6. 11217510 - Semiconductor device including a bidirectional switch (2022-01-04),
7. 11081455 - Semiconductor device with bond pad extensions formed on molded appendage (2021-08-03),
8. 10903133 - Method of producing an SMD package with top side cooling (2021-01-26),
9. 10763246 - Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material (2020-09-01),
10. 10755999 - Multi-package top-side-cooling (2020-08-25),
11. 10699987 - SMD package with flat contacts to prevent bottleneck (2020-06-30),
12. 10698021 - Device including a compound semiconductor chip (2020-06-30),
13. 10566260 - SMD package with top side cooling (2020-02-18),
14. 10418319 - Method of manufacturing a semiconductor device (2019-09-17),
15. 10290566 - Electronic component (2019-05-14),

Title: The Innovative Journey of Klaus Schiess

Introduction: Klaus Schiess, a pioneering inventor hailing from Allensbach, Germany, has made significant contributions to the world of innovations with his creative mind and dedication to progress.

Latest Patents: Klaus Schiess holds several patents in various fields, including technology, engineering, and manufacturing. His recent patents focus on advancements in renewable energy solutions and sustainable transportation methods.

Career Highlights: Throughout his illustrious career, Klaus Schiess has been recognized for his groundbreaking inventions that have revolutionized industries. His innovative spirit has led to the development of cutting-edge technologies that have improved efficiency and sustainability.

Collaborations: Klaus Schiess has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that benefit society.

Conclusion: Klaus Schiess stands as a testament to the power of innovation and the impact that one individual can have on the world. His relentless pursuit of progress and commitment to pushing boundaries continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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