The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Mar. 06, 2024
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Markus Dinkel, Unterhaching, DE;

Thai Kee Gan, Melaka Tengah, MY;

Teck Sim Lee, Melaka, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 74/10 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/464 (2026.01); H10W 70/417 (2026.01); H10W 70/427 (2026.01); H10W 70/442 (2026.01); H10W 74/111 (2026.01); H10W 72/073 (2026.01); H10W 72/07336 (2026.01); H10W 72/076 (2026.01); H10W 72/07636 (2026.01); H10W 72/886 (2026.01); H10W 90/736 (2026.01); H10W 90/763 (2026.01);
Abstract

A method includes providing first and second lead frames, each including a die pad and a plurality of contacts, providing first and second semiconductor dies, each comprising a first terminal and a second terminal, providing a first clip frame that includes a first die mating pad, a second die mating pad, and a bridge section, mounting the first semiconductor die on the first lead frame, mounting the second semiconductor die on the second lead frame, and attaching the first clip frame to the first and second semiconductor dies such that the first die mating pad faces and electrically connects with the first terminal of the first semiconductor die and such that the second die mating pad faces and electrically connects with the first terminal of the second semiconductor die.


Find Patent Forward Citations

Otremba, Ralf. (2026). Semiconductor package with hybrid interconnect clip (U.S. Patent No. 12765398). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765398

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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