The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Feb. 22, 2016
Infineon Technologies Ag, Neubiberg, DE;
Giuliano Angelo Babulano, Ottobrunn, DE;
Jens Oetjen, Ottenhofen, DE;
Liu Chen, Munich, DE;
Toni Salminen, Munich, DE;
Stefan Mieslinger, Kottgeisering, DE;
Markus Dinkel, Unterhaching, DE;
Martin Gruber, Schwandorf, DE;
Franz Jost, Stuttgart, DE;
Thorsten Meyer, Regensburg, DE;
Rainer Schaller, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.