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For the Inventor, By the Inventor

Oberhaching, Germany

Liu Chen

USPTO Granted Patents = 11

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 28(Granted Patents)


Location History:

  • Oberhaching, DE (2019 - 2023)
  • Munich, DE (2016 - 2024)

Company Filing History:

goldMedal11 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2016-2024

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11 patents (USPTO):
1. 11903132 - Power electronic assembly having a laminate inlay and method of producing the power electronic assembly (2024-02-13),
2. 11632860 - Power electronic assembly and method of producing thereof (2023-04-18),
3. 11239127 - Topside-cooled semiconductor package with molded standoff (2022-02-01),
4. 11127853 - Power transistor device including first and second transistor cells having different on-resistances for improved thermal stability (2021-09-21),
5. 10727151 - Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package (2020-07-28),
6. 10290567 - Transistor package with three-terminal clip (2019-05-14),
7. 10168391 - Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto (2019-01-01),
8. 9681558 - Module with integrated power electronic circuitry and logic circuitry (2017-06-13),
9. 9564578 - Semiconductor package with integrated magnetic field sensor (2017-02-07),
10. 9564423 - Power package with integrated magnetic field sensor (2017-02-07),
11. 9385059 - Overmolded substrate-chip arrangement with heat sink (2016-07-05),

Title: Liu Chen - Innovator in Power Electronics

Introduction

Liu Chen is a prominent inventor based in Oberhaching, Germany. He has made significant contributions to the field of power electronics, holding a total of 11 patents. His innovative work focuses on enhancing the efficiency and functionality of power electronic assemblies.

Latest Patents

Liu Chen's latest patents include a power electronic assembly featuring a laminate inlay and a method for producing this assembly. This invention comprises a board with metal layers laminated onto or between electrically insulating layers, along with a laminate inlay embedded within the board. The design includes multiple metal layers that provide electrical contacts and thermal connections, ensuring effective load current distribution and heat management during operation.

Career Highlights

Liu Chen is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has positioned him as a key player in the development of advanced power electronic systems. His expertise in this area has led to numerous innovations that enhance the performance of electronic devices.

Collaborations

Liu Chen collaborates with talented coworkers such as Markus Dinkel and Toni Salminen. Together, they contribute to the advancement of technology in the power electronics sector.

Conclusion

Liu Chen's contributions to power electronics through his patents and work at Infineon Technologies AG highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of electronic assemblies.

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