The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Aug. 12, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Liu Chen, Munich, DE;

Markus Dinkel, Unterhaching, DE;

Toni Salminen, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 3/40 (2006.01); H05K 7/06 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/40 (2013.01); H05K 3/4697 (2013.01); H05K 7/06 (2013.01); H01L 2224/18 (2013.01); H05K 3/0017 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided.


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