The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Nov. 20, 2015
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Meyer, Regensburg, DE;
Martin Gruber, Schwandorf, DE;
Rainer Markus Schaller, Regensburg, DE;
Franz Jost, Stuttgart, DE;
Stefan Mieslinger, Kottgeisering, DE;
Liu Chen, Munich, DE;
Toni Salminen, Munich, DE;
Giuliano Angelo Babulano, Ottobrunn, DE;
Jens Oetjen, Ottenhofen, DE;
Markus Dinkel, Unterhaching, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.