The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Dec. 21, 2022
Infineon Technologies Ag, Neubiberg, DE;
Hooi Boon Teoh, Melaka, MY;
Hao Zhuang, Hohenbrunn, DE;
Oliver Blank, Villach, AT;
Paul Armand Calo, Villach, AT;
Markus Dinkel, Unterhaching, DE;
Josef Höglauer, Kirchheim-Heimstetten, DE;
Daniel Hólzl, Reisbach, DE;
Wee Aun Jason Lim, Bukit Katil, MY;
Gerhard Thomas Nöbauer, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Martin Pölzl, Ossiach, AT;
Ying Pok Sam, Bukit Katil, MY;
Xaver Schlögel, Sachsenkam, DE;
Chee Voon Tan, Seremban, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor chip is provided. The semiconductor chip may include a front side including a control chip contact and a first controlled chip contact, a back side including a second controlled chip contact, a backside metallization formed over the back side in contact with the second controlled chip contact, and a stop region extending at least partially along an outer edge of the back side between a contact portion of the backside metallization and the outer edge of the back side. The contact portion is configured to be attached to an electrically conductive structure by a die attach material, a surface of the stop region is recessed with respect to a surface of the contact portion, and/or the surface of the stop region has a lower wettability with respect to the die attach material than the contact portion.