This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hooi Boon Teoh: Innovator in Semiconductor Technology
Introduction
Hooi Boon Teoh is a notable inventor based in Malacca, Malaysia. She has made significant contributions to the field of semiconductor technology, particularly through her innovative patent.
Latest Patents
Hooi Boon Teoh holds a patent for a semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip system. This semiconductor chip includes a front side with a control chip contact and a first controlled chip contact. The back side features a second controlled chip contact and backside metallization that is in contact with the second controlled chip contact. Additionally, a stop region extends partially along the outer edge of the back side, enhancing the chip's functionality and reliability.
Career Highlights
Hooi Boon Teoh is currently employed at Infineon Technologies AG, where she continues to develop cutting-edge semiconductor solutions. Her work has been instrumental in advancing the capabilities of semiconductor chips, making them more efficient and reliable for various applications.
Collaborations
Throughout her career, Hooi has collaborated with talented individuals such as Hao Zhuang and Oliver Blank. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Hooi Boon Teoh's contributions to semiconductor technology exemplify her dedication to innovation and excellence in her field. Her patent and work at Infineon Technologies AG highlight her role as a leading inventor in the industry.