Malacca, Malaysia

Ying Pok Sam

This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2021-2026.


% Patents Active = 100.0

Average Co-Inventor Count = 9.3

ph-index = 1


Company Filing History:


Years Active: 2021-2026

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2 patents (USPTO):Explore Patents

Title: Innovations by Ying Pok Sam

Introduction

Ying Pok Sam is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of power semiconductor technology. His innovative work has led to the development of a unique power semiconductor package.

Latest Patents

Ying Pok Sam holds a patent for a "Power semiconductor package and method for fabricating a power semiconductor package." This invention includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip, and an encapsulation body that partially encapsulates the chip and connector. The design also features an electrical insulation layer that contributes to the overall functionality and efficiency of the semiconductor package. He has 1 patent to his name.

Career Highlights

Ying Pok Sam is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at the company allows him to apply his expertise in developing advanced technologies that enhance power management and efficiency.

Collaborations

Throughout his career, Ying Pok Sam has collaborated with talented individuals such as Wee Aun Jason Lim and Paul Armand Asentista Calo. These collaborations have fostered innovation and contributed to the success of various projects.

Conclusion

Ying Pok Sam's contributions to the field of power semiconductor technology exemplify his dedication to innovation. His patent and work at Infineon Technologies AG highlight his role as a key player in advancing semiconductor solutions.

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