This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovations of Daniel Hólzl
Introduction
Daniel Hólzl is a notable inventor based in Reisbach, Germany. He has made significant contributions to the field of semiconductor technology. His work focuses on the development of advanced semiconductor chips and systems.
Latest Patents
Hólzl holds a patent for a semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip system. The patent describes a semiconductor chip that includes a front side with a control chip contact and a first controlled chip contact. The back side features a second controlled chip contact and backside metallization that is in contact with the second controlled chip contact. Additionally, a stop region extends partially along the outer edge of the back side, enhancing the chip's functionality and reliability.
Career Highlights
Hólzl is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His expertise in semiconductor technology has positioned him as a valuable asset to the company. He has been instrumental in advancing the design and manufacturing processes of semiconductor chips.
Collaborations
Throughout his career, Hólzl has collaborated with talented professionals in the field, including Hooi Boon Teoh and Hao Zhuang. These collaborations have fostered innovation and contributed to the successful development of new technologies.
Conclusion
Daniel Hólzl's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Infineon Technologies AG highlight his commitment to advancing the field. His collaborations further enhance the impact of his inventions in the industry.