The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Oct. 14, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Toni Salminen, Munich, DE;
Markus Dinkel, Unterhaching, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/32 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 23/14 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H05K 1/0271 (2013.01); H05K 3/4688 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 3/284 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/068 (2013.01);
Abstract
Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.