Boon Kian Lim

Title: Boon Kian Lim: Innovator in Semiconductor Technology

Introduction

Boon Kian Lim is a notable inventor based in Melacca, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for fabricating semiconductor packages, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is titled "Method of fabricating a semiconductor package with mold lock opening." This method involves forming a mold cavity around a portion of a leadframe, which includes a mold lock opening that extends through the leadframe. A spacer is inserted to fill part of the mold lock opening, and the cavity is filled with an encapsulating material. Another significant patent is "Electronic device having profiled elements extending from planar surfaces." This invention describes an electronic device that includes a leadframe, a chip attached to it, and encapsulation material covering the leadframe's edges, which feature profiled elements.

Career Highlights

Boon Kian Lim has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies LLC. His experience in these organizations has allowed him to develop and refine his innovative approaches to semiconductor packaging.

Collaborations

He has collaborated with notable professionals in the field, including Bernd Goller and Markus Dinkel. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a culture of innovation.

Conclusion

Boon Kian Lim's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the development of electronic devices, showcasing the importance of innovation in technology.