The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Sep. 27, 2005
Wae Chet Yong, Melaka, MY;
Mohd Fauzi Hj Mahat, Melaka, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Tien Lai Tan, Melaka, MY;
Wae Chet Yong, Melaka, MY;
Mohd Fauzi HJ Mahat, Melaka, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Tien Lai Tan, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile