The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Feb. 22, 2008
Applicants:
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Erich Griebl, Dorfen, DE;
Mario Feldvoss, Munich, DE;
Juergen Schredl, Mering, DE;
Inventors:
Wae Chet Yong, Malacca, MY;
Teck Sim Lee, Malacca, MY;
Erich Griebl, Dorfen, DE;
Mario Feldvoss, Munich, DE;
Juergen Schredl, Mering, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device.