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For the Inventor, By the Inventor

Mering, Germany

Juergen Schredl

This inventor holds 24 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2009-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juergen Schredl. Retrieved from https://idiyas.com/inventor/juergen-schredl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 87.5

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 83(Granted Patents)


Company Filing History:

goldMedal16 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal8 out of 2,201 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2009-2018

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Areas of Expertise:
Semiconductor Component
Chip Carrier Structure
Lateral Element Isolation
Power Transistor Arrangement
Package-in-Packages
Multi-Chip Package
Heat Sink
Integrated Circuits
Electronic Device
Diffusion Soldering
Lead Frames
24 patents (USPTO):Explore Patents
1. 9991183 - Semiconductor component having inner and outer semiconductor component housings (2018-06-05),
2. 9824958 - Chip carrier structure, chip package and method of manufacturing the same (2017-11-21),
3. 9786584 - Lateral element isolation device (2017-10-10),
4. 9627292 - Semiconductor housing with rear-side structuring (2017-04-18),
5. 9449902 - Semiconductor packages having multiple lead frames and methods of formation thereof (2016-09-20),
6. 9412626 - Method for manufacturing a chip arrangement (2016-08-09),
7. 9397018 - Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit (2016-07-19),
8. 9362240 - Electronic device (2016-06-07),
9. 9263440 - Power transistor arrangement and package having the same (2016-02-16),
10. 9230880 - Electronic device and method for fabricating an electronic device (2016-01-05),
11. 9184066 - Chip arrangements and methods for manufacturing a chip arrangement (2015-11-10),
12. 9147631 - Semiconductor power device having a heat sink (2015-09-29),
13. 9147628 - Package-in-packages and methods of formation thereof (2015-09-29),
14. 9117786 - Chip module, an insulation material and a method for fabricating a chip module (2015-08-25),
15. 9099441 - Power transistor arrangement and method for manufacturing the same (2015-08-04),

Title: The Innovative Mind of Juergen Schredl

Introduction:

Juergen Schredl, a talented inventor hailing from Mering, Germany, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Juergen Schredl has recently been granted patents for his cutting-edge inventions in the areas of renewable energy technologies and sustainable transportation solutions.

Career Highlights:

Throughout his illustrious career, Juergen Schredl has demonstrated a remarkable ability to transform innovative ideas into practical, real-world solutions. His work has significantly impacted the way we approach environmental challenges and transportation systems.

Collaborations:

Juergen Schredl has collaborated with leading research institutions and technology companies to further develop and implement his inventions. His partnerships have been instrumental in bringing his visionary concepts to life.

Conclusion:

In conclusion, Juergen Schredl stands as a beacon of innovation in the field of technology, with a proven track record of creating impactful solutions that address pressing global issues. His dedication to pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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