The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Mar. 05, 2013
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Helmstetten, DE;
Juergen Schredl, Mering, DE;
Xaver Schloegel, Sachsenkam, DE;
Klaus Schiess, Allensbach, DE;
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/561 (2013.01); H01L 23/4334 (2013.01); H01L 23/49562 (2013.01); H01L 23/49861 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/89 (2013.01); H01L 24/97 (2013.01); H01L 23/49558 (2013.01); H01L 23/49586 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49002 (2015.01);
Abstract
Various embodiments provide a chip carrier structure. The chip carrier structure may include a structured metallic chip carrier; encapsulating material at least partially filling the structure; wherein the main surfaces of the metallic chip carrier are free from the encapsulating material.