The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Nov. 09, 2015
Infineon Technologies Ag, Neubiberg, DE;
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Heimstetten, DE;
Juergen Schredl, Mering, DE;
Xaver Schloegel, Sachsenkam, DE;
Klaus Schiess, Allensbach, DE;
Bernd Roemer, Bernhardswald, DE;
Edward Fuergut, Dasing, DE;
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Abstract
A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side.