The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jan. 28, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Heimstetten, DE;
Juergen Schredl, Mering, DE;
Teck Sim Lee, Melaka, MY;
Xaver Schloegel, Sachsenkam, DE;
Klaus Schiess, Allensbach, DE;
Assignee:
Infineon Technolgies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/40 (2006.01); H01L 21/3105 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/31053 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/4093 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/83 (2013.01); H01L 23/4334 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01);
Abstract
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.