The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Jan. 16, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Heimstetten, DE;

Juergen Schredl, Mering, DE;

Xaver Schloegel, Sachsenkam, DE;

Wolfram Hable, Neumarkt, DE;

Manfred Mengel, Bad Abbach, DE;

Joachim Mahler, Regensburg, DE;

Khalil Hosseini, Weihmichl, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/06 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 21/56 (2013.01); H01L 23/06 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.


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