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For the Inventor, By the Inventor

Neumarkt, Germany

Wolfram Hable

USPTO Granted Patents = 18 

 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 46(Granted Patents)


Company Filing History:

goldMedal16 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal2 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2007-2025

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18 patents (USPTO):
1. 12438063 - Electronic module including a semiconductor package disposed on an interposer layer (2025-10-07),
2. 11955407 - Electronic module including a semiconductor package connected to a fluid heatsink (2024-04-09),
3. 11862533 - Fluid-cooled package having shielding layer (2024-01-02),
4. 11574889 - Power module comprising two substrates and method of manufacturing the same (2023-02-07),
5. 11244886 - Package cooled with cooling fluid and comprising shielding layer (2022-02-08),
6. 10615097 - Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet (2020-04-07),
7. 10461017 - Package with partially encapsulated cooling channel for cooling an encapsulated chip (2019-10-29),
8. 10283432 - Molded package with chip carrier comprising brazed electrically conductive layers (2019-05-07),
9. 10128165 - Package with vertically spaced partially encapsulated contact structures (2018-11-13),
10. 10079195 - Semiconductor chip package comprising laterally extending connectors (2018-09-18),
11. 10074590 - Molded package with chip carrier comprising brazed electrically conductive layers (2018-09-11),
12. 10037972 - Electronic module comprising fluid cooling channel and method of manufacturing the same (2018-07-31),
13. 9589922 - Electronic module and method of manufacturing the same (2017-03-07),
14. 9585241 - Substrate, chip arrangement, and method for manufacturing the same (2017-02-28),
15. 9397018 - Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit (2016-07-19),

Title: The Innovator Extraordinaire: Wolfram Hable's Legacy in Technology

Introduction:

Wolfram Hable, an acclaimed inventor hailing from Neumarkt, DE, has carved a prominent place for himself in the realm of technology with his groundbreaking inventions and unwavering dedication to excellence.

Latest Patents:

Among his impressive portfolio of 17 patents, Wolfram Hable's latest inventions include an electronic module incorporating a semiconductor package connected to a fluid heatsink and a fluid-cooled package with a shielding layer. These innovative creations showcase his prowess in developing cutting-edge solutions in the field of electronics and thermal management.

Career Highlights:

Having contributed his expertise to renowned companies like Infineon Technologies AG and Infineon Technologies Austria AG, Wolfram Hable has left an indelible mark on the industry with his inventive solutions and forward-thinking approach. His knack for pushing boundaries and exploring new frontiers has solidified his reputation as a pioneer in his field.

Collaborations:

Throughout his career, Wolfram Hable has collaborated with esteemed colleagues such as Andreas Grassmann and Juergen Hoegerl, pooling their collective knowledge and ingenuity to bring forth revolutionary advancements in technology. These partnerships have been instrumental in driving innovation and fostering a culture of creativity within the industry.

Conclusion:

In conclusion, Wolfram Hable's remarkable journey as an inventor exemplifies the spirit of ingenuity and perseverance, inspiring generations to come. His trailblazing work continues to shape the landscape of technology, leaving an indelible legacy that resonates with all who aspire to innovate and redefine what is possible in the world of inventions.

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